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MAX44269

1.3mm x 1.3mm, Low-Power

Dual Comparator

INA+, INA-, INB+, INB- to GND..............................-0.3V to +6V

Continuous Input Current into Any Pin............................ Q20mA

Maximum Power Dissipation

Output Voltage to GND (OUT_) ..............................-0.3V to +6V

Output Current (OUT_).................................................... Q50mA

Output Short-Circuit Duration (OUT_) .......................Continuous

Operating Temperature Range.......................... -40NC to +85NC

Storage Temperature Range............................ -65NC to +150NC

Junction Temperature .....................................................+150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

WLP

Junction-to-Ambient Thermal Resistance (

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

otherwise noted.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Input-Referred Hysteresis

4

6

mV

Input Offset Voltage

0.15

5

mV

10

Input Bias Current

0.15

nA

0.2

Output-Voltage Swing Low

105

200

mV

300

285

350

450

Input Voltage Range

- 0.2V

+ 0.2V

V

Output Short-Circuit

Current

3

mA

30

Output Leakage Current

0.2

nA