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W25Q16CVSSIG Datasheet(PDF) 6 Page - Winbond |
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W25Q16CVSSIG Datasheet(HTML) 6 Page - Winbond |
6 / 79 page W25Q16CV - 6 - 3. PACKAGE TYPES AND PIN CONFIGURATIONS W25Q16CV is offered in an 8-pin SOIC 150-mil or 208-mil (package code SN & SS), an 8-pad WSON 6x5-mm (package code ZP), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively. Package diagrams and dimensions are illustrated at the end of this datasheet. 3.1 Pin Configuration SOIC 150 / 208-mil 1 2 3 4 8 7 6 5 /CS DO (IO 1) /WP (IO 2) GND VCC /HOLD (IO DI (IO 0) CLK Top View 3) Figure 1a. W25Q16CV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS) 3.2 Pad Configuration WSON 6x5-mm 1 2 3 4 /CS DO (IO 1) /WP (IO 2) GND VCC /HOL DI (IO CLK D (IO 3) 0) Top View 8 7 6 5 Figure 1b. W25Q16CV Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP) |
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Similar Description - W25Q16CVSSIG |
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