Electronic Components Datasheet Search |
|
W25Q32BVDAAP Datasheet(PDF) 2 Page - Winbond |
|
W25Q32BVDAAP Datasheet(HTML) 2 Page - Winbond |
2 / 79 page W25Q32BV - 2 - Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm ..................................................................... 6 3.3 Pin Configuration PDIP 300-mil............................................................................................ 7 3.4 Pin Description SOIC 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil ............................... 7 3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.6 Pin Description SOIC 300-mil............................................................................................... 8 3.7 Ball Configuration TFBGA 8x6-mm ...................................................................................... 9 3.8 Ball Description TFBGA 8x6-mm ......................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Select (/CS) ................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)................................... 10 4.3 Write Protect (/WP) ............................................................................................................ 10 4.4 HOLD (/HOLD) ................................................................................................................... 10 4.5 Serial Clock (CLK) .............................................................................................................. 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS..................................................................................................... 12 6.1 SPI OPERATIONS ............................................................................................................. 12 6.1.1 Standard SPI Instructions.....................................................................................................12 6.1.2 Dual SPI Instructions............................................................................................................12 6.1.3 Quad SPI Instructions ..........................................................................................................12 6.1.4 Hold Function .......................................................................................................................12 6.2 WRITE PROTECTION ....................................................................................................... 13 6.2.1 Write Protect Features .........................................................................................................13 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14 7.1 STATUS REGISTERS........................................................................................................ 14 7.1.1 BUSY Status (BUSY) ...........................................................................................................14 7.1.2 Write Enable Latch Status (WEL) ........................................................................................14 7.1.3 Block Protect Bits (BP2, BP1, BP0) .....................................................................................14 7.1.4 Top/Bottom Block Protect Bit (TB) .......................................................................................14 7.1.5 Sector/Block Protect Bit (SEC).............................................................................................14 7.1.6 Complement Protect Bit (CMP) ............................................................................................15 7.1.7 Status Register Protect Bits (SRP1, SRP0) .........................................................................15 7.1.8 Erase/Program Suspend Status (SUS) ................................................................................15 7.1.9 Security Register Lock Bits (LB3, LB2, LB1)........................................................................15 |
Similar Part No. - W25Q32BVDAAP |
|
Similar Description - W25Q32BVDAAP |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |