W25X32BV

- 2 -

Table of Contents

1.

......................................................................................................... 4

GENERAL DESCRIPTION

2.

................................................................................................................................. 4

FEATURES

3.

....................................................................................... 5

PIN CONFIGURATION SOIC 208-MIL

4.

..................................................... 5

PAD CONFIGURATION WSON 6X5-MM / WSON 8X6-MM

5.

.................................... 5

PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM

6.

....................................................................................... 6

PIN CONFIGURATION SOIC 300-MIL

7.

............................................................................................ 6

PIN DESCRIPTION SOIC 300-MIL

7.1

............................................................................................................... 7

Package Types

7.2

............................................................................................................ 7

Chip Select (/CS)

7.3

................................................................................................. 7

Serial Data Output (DO)

7.4

......................................................................................................... 7

Write Protect (/WP)

7.5

............................................................................................................... 7

HOLD (/HOLD)

7.6

.......................................................................................................... 7

Serial Clock (CLK)

7.7

..................................................................................... 7

Serial Data Input / Output (DIO)

8.

...................................................................................................................... 8

BLOCK DIAGRAM

9.

................................................................................................... 9

FUNCTIONAL DESCRIPTION

9.1

......................................................................................................... 9

SPI OPERATIONS

9.1.1

........................................................................................................................9

SPI Modes

9.1.2

................................................................................................................9

Dual Output SPI

9.1.3

...................................................................................................................9

Hold Function

9.2

.................................................................................................. 10

WRITE PROTECTION

9.2.1

....................................................................................................10

Write Protect Features

10.

................................................................................... 11

CONTROL AND STATUS REGISTERS

10.1

.................................................................................................... 11

STATUS REGISTER

10.1.1

............................................................................................................................11

BUSY

10.1.2

............................................................................................11

Write Enable Latch (WEL)

10.1.3

..............................................................................11

Block Protect Bits (BP2, BP1, BP0)

10.1.4

.....................................................................................11

Top/Bottom Block Protect (TB)

10.1.5

...............................................................................................................11

Reserved Bits

10.1.6

......................................................................................12

Status Register Protect (SRP)

10.1.7

..............................................................................12

Status Register Memory Protection

10.2

........................................................................................................... 13

INSTRUCTIONS

10.2.1

.........................................................................13

Manufacturer and Device Identification

10.2.2

...............................................................................................................14

Instruction Set

10.2.3

........................................................................................................15

Write Enable (06h)

10.2.4

.......................................................................................................15

Write Disable (04h)

10.2.5

..........................................................................................16

Read Status Register (05h)