W25X16, W25X16A, W25X32, W25X64

Publication Release Date: may 5, 2008

- 3 -

Revision I

12.2.2

Instruction Set...............................................................................................................17

12.2.3

Write Enable (06h)........................................................................................................18

12.2.4

Write Disable (04h) .......................................................................................................18

12.2.5

Read Status Register (05h) ..........................................................................................19

12.2.6

Write Status Register (01h) ..........................................................................................20

12.2.7

Read Data (03h) ...........................................................................................................21

12.2.8

Fast Read (0Bh) ...........................................................................................................22

12.2.9

Fast Read Dual Output (3Bh) .......................................................................................23

12.2.10

Page Program (02h) ...................................................................................................24

12.2.11

Sector Erase (20h) .....................................................................................................25

12.2.12

Block Erase (D8h) ......................................................................................................26

12.2.13

Chip Erase (C7h) ........................................................................................................27

12.2.14

Power-down (B9h) ......................................................................................................28

12.2.15

Release Power-down / Device ID (ABh) .....................................................................29

12.2.16

Read Manufacturer / Device ID (90h) .........................................................................31

12.2.17

JEDEC ID (9Fh)..........................................................................................................32

13.

ELECTRICAL CHARACTERISTICS......................................................................................... 33

13.1

Absolute Maximum Ratings .......................................................................................... 33

13.2

Operating Ranges......................................................................................................... 33

13.3

Endurance and Data Retention .................................................................................... 34

13.4

Power-up Timing and Write Inhibit Threshold .............................................................. 34

13.5

DC Electrical Characteristics ........................................................................................ 35

13.6

AC Measurement Conditions........................................................................................ 36

13.7

AC Electrical Characteristics ........................................................................................ 37

13.8

Serial Output Timing ..................................................................................................... 39

13.9

Input Timing .................................................................................................................. 39

13.10

Hold Timing ................................................................................................................. 39

14.

PACKAGE SPECIFICATION .................................................................................................... 40

14.1

8-Pin SOIC 150-mil (Package Code SN)...................................................................... 40

14.2

8-Pin SOIC 208-mil (Package Code SS)...................................................................... 41

14.3

8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 42

14.4

8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 43

14.5

8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 45

14.6

16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 46

15.

ORDERING INFORMATION .................................................................................................... 47

16.

REVISION HISTORY ................................................................................................................ 49