UCC27200A, UCC27201A

SLUSAF9A

– FEBRUARY 2011 – REVISED DECEMBER 2011

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THERMAL INFORMATION

UCC27200A

UCC27200A

UCC27200A

/UCC27201A

/UCC27201A

/UCC27201A

UNITS

DRM

DRC

DPR

8 PINS

9 PINS

10 PINS

Junction-to-ambient thermal resistance

36.2

43.7

34.8

Junction-to-case (top) thermal resistance

41.6

49.9

32.1

Junction-to-board thermal resistance

13.2

19.1

11.9

°C/W

Junction-to-top characterization parameter

0.6

0.6

0.2

Junction-to-board characterization parameter

13.4

19.3

12.2

Junction-to-case (bottom) thermal resistance

3.1

3.8

1.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

THERMAL INFORMATION

UCC27200A

UCC27200A

/UCC27201A

/UCC27201A

UNITS

D

DDA

8 PINS

8 PINS

Junction-to-ambient thermal resistance

106.5

40.5

Junction-to-case (top) thermal resistance

52.9

49.0

Junction-to-board thermal resistance

46.6

10.2

°C/W

Junction-to-top characterization parameter

9.6

3.1

Junction-to-board characterization parameter

46.1

9.7

Junction-to-case (bottom) thermal resistance

n/a

1.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

4

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© 2011, Texas Instruments Incorporated

Product Folder Link(s): UCC27200A UCC27201A