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ESTW004A2C41-HZ Datasheet(PDF) 10 Page - Lineage Power Corporation |
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ESTW004A2C41-HZ Datasheet(HTML) 10 Page - Lineage Power Corporation |
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10 / 18 page  Data Sheet August 30, 2011 ESTW004A2C Series DC-DC Converter Power Modules 36–75Vdc Input; 15.0Vdc/4.2Adc Output LINEAGE POWER 10 Surface Mount Information Pick and Place The ESTW004A2C modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 oC. The label also carries product information such as product code, serial number and the location of manufacture. Figure 18. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. The surface mountable modules in the ESTW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 19 shows the new CP connector before and after reflow soldering onto the end-board assembly. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non- Z codes, or Sn/Ag3/Cu (SAC) solder for –Z codes. Figure 19. Column Pin Connector Before and After Reflow Soldering . The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183 oC (Sn/Pb solder) or 217-218 oC (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable Tin Lead Soldering The ESTW004A2C power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235 oC. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. Lead Free Soldering The –Z version of the ESTW004A2C modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. |
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