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QBVW033A0B941-HZ Datasheet(PDF) 11 Page - Lineage Power Corporation |
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QBVW033A0B941-HZ Datasheet(HTML) 11 Page - Lineage Power Corporation |
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11 / 18 page  Data Sheet September 23, 2011 QBVW033A0B Series Power Modules; DC-DC Converters 36-75Vdc Input; 12Vdc Output; 33A Output Current LINEAGE POWER 11 LOCAL AMBIENT TEMPERATURE, TA (C) Figure 23. Output Current Derating for the Base plate QBVW033A0B-H with 1.0” heatsink in the Transverse Orientation; Airflow Direction from Vin(+) to Vin(-); Vin = 48V. Layout Considerations The QBVW033 power module series are low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power module and the mounting board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. For additional layout guide-lines, refer to FLTR100V10 Data Sheet. Through-Hole Lead-Free Soldering Information The RoHS-compliant, Z version, through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. The module is designed to be processed through single or dual wave soldering machines. The pins have a RoHS- compliant, pure tin finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3 C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210 C. For Pb solder, the recommended pot temperature is 260 C, while the Pb-free solder pot is 270 C max. Reflow Lead-Free Soldering Information The RoHS-compliant through-hole products can be processed with the following paste-through-hole Pb or Pb-free reflow process. Max. sustain temperature : 245 C (J-STD-020C Table 4-2: Packaging Thickness>=2.5mm / Volume > 2000mm 3), Peak temperature over 245 C is not suggested due to the potential reliability risk of components under continuous high-temperature. Min. sustain duration above 217 C : 90 seconds Min. sustain duration above 180 C : 150 seconds Max. heat up rate: 3 C/sec Max. cool down rate: 4 C/sec In compliance with JEDEC J-STD-020C spec for 2 times reflow requirement. Pb-free Reflow Profile BMP module will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. BMP will comply with JEDEC J-STD- 020C specification for 3 times reflow requirement. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 24. LOCAL AMBIENT TEMPERATURE, TA (C) Figure 21. Output Current Derating for the Base plate QBVW033A0B-H with 0.25” heatsink in the Transverse Orientation; Airflow Direction from Vin(+) to Vin(-); Vin = 48V. LOCAL AMBIENT TEMPERATURE, TA (C) Figure 22. Output Current Derating for the Base plate QBVW033A0B-H with 0.5” heatsink in the Transverse Orientation; Airflow Direction from Vin(+) to Vin(-); Vin = 48V. |
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