BGA 425

Semiconductor Group

Jul-14-1998

3

Typical configuration

Application 1 - 3 (LNA)

Application 4 (Mix)

Appl.1

Appl.2

EHA07372

100 pF

100 pF

100 pF

10 nF

+3 V

RF OUT

RF IN

BGA 425

EHA07373

2.2 pF

100 pF

100 pF

10 nF

+3 V

RF OUT

RF IN

100 pF

100 nH

BGA 425

Appl.3

Appl.4

EHA07375

1 nF

100 pF

IF

RF

47 pF

180 nH

LO

Ω

33

47 pF

22 nH

10 nF

100 pF

+

V

BGA 425

EHA07374

100 pF

100 pF

100 pF

10 nF

+3 V

RF OUT

RF IN

100 pF

BGA 425

Note: 1) Large-value capacitors should be connected from pin 6 to ground right at the device

to provide a low impedance path! (appl. 1)

2) The use of plated through holes right at pin 2 and 5 is essential for pc-board-applications.

Thin boards are recommended to minimize the parasitic inductance to ground!

3) For more information please see application note 028 and 030.

Semiconductor Group

3

1998-11-01