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UCC27423QDGNRQ1 Datasheet(PDF) 3 Page - Texas Instruments |
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UCC27423QDGNRQ1 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 28 page UCC27423-Q1 UCC27424-Q1 UCC27425-Q1 www.ti.com SGLS274D – SEPTEMBER 2008 – REVISED AUGUST 2011 INPUT/OUTPUT TABLE INPUTS (VIN_L, VIN_H) UCC27423 UCC27424 UCC27425 ENBA ENBB INA INB OUTA OUTB OUTA OUTB OUTA OUTB H H L L H H L L H L H H L H H L L H H H H H H L L H H L L L H H H H L L H H L H L L X X L L L L L L ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) VDD Supply voltage –0.3 V to 16 V DC 0.3 A IOUT Output current Pulsed, 0.5 μs 4.5 A –5 V to 6 V or (VDD + 0.3) VIN Input voltage INA, INB (whichever is larger) –0.3 V to 6 V or (VDD + 0.3) VEN Enable voltage ENBA, ENBB (whichever is larger) PD Power dissipation TA = 25°C 650 mW TJ Junction operating temperature range –55°C to 150°C Tstg Storage temperature range –65°C to 150°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to GND. Currents are positive into, negative out of, the specified terminal. DISSIPATION RATINGS DERATING FACTOR POWER RATING PACKAGE θJC (°C/W) θJA (°C/W) ABOVE TA = 70°C TA = 70°C (mW) (1) (mW/ °C)(1) D (SOIC-8) 42 84 to 160(2) 344 to 655(2) 6.25 to 11.9(2) DGN (MSOP 4.7 50 to 59 1370 17.1 PowerPAD)(3) (1) 125 °C operating junction temperature is used for power rating calculations. (2) The range of values indicates the effect of the PCB. These values are intended to give the system designer an indication of the best- and worst-case conditions. In general, the system designer should attempt to use larger traces on the PCB, where possible, to spread the heat away form the device more effectively. (3) The PowerPAD ™ is not directly connected to any leads of the package. However, it is electronically and thermally connected to the substrate which is the ground of the device. Copyright © 2008–2011, Texas Instruments Incorporated 3 |
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