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BD9130NV Datasheet(PDF) 11 Page - Rohm

Part # BD9130NV
Description  2.7V to 5.5V, 2.0A 1ch Synchronous Buck Converter integrated FET
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Manufacturer  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BD9130NV Datasheet(HTML) 11 Page - Rohm

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TSZ02201-0J3J0AJ00130-1-2
©
ROHM Co., Ltd. All rights reserved.
11/18
02.MAR.2012 Rev.001
TSZ22111・15・001
BD9130NV
Datasheet
Switching Regulator Efficiency
Efficiency ŋ may be expressed by the equation shown below:
Efficiency may be improved by reducing the switching regulator power dissipation factors PD
α as follows:
Dissipation factors:
1) ON resistance dissipation of inductor and FET:PD(I
2R)
2) Gate charge/discharge dissipation:PD(Gate)
3) Switching dissipation:PD(SW)
4) ESR dissipation of capacitor:PD(ESR)
5) Operating current dissipation of IC:PD(IC)
1)PD(I
2R)=IOUT2×(RCOIL+RON) (RCOIL[Ω]:DC resistance of inductor, RON[Ω]:ON resistance of FET, IOUT[A]:Output
current.)
2)PD(Gate)=Cgs×f×V
(Cgs[F]:Gate capacitance of FET,f[H]:Switching frequency,V[V]:Gate driving voltage of FET)
4)PD(ESR)=IRMS
2×ESR (IRMS[A]:Ripple current of capacitor,ESR[Ω]:Equivalent series resistance.)
5)PD(IC)=Vin×ICC
(ICC[A]:Circuit current.)
Consideration on Permissible Dissipation and Heat Generation
As this IC functions with high efficiency without significant heat generation in most applications, no special consideration is
needed on permissible dissipation or heat generation.
In case of extreme conditions, however, including lower input
voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation
must be carefully considered.
For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered.
Because the conduction losses are considered to play the leading role among other dissipation mentioned above including
gate charge/discharge dissipation and switching dissipation.
If VCC=3.3V, VOUT=1.8V, RONP
=0.2Ω, RONN=0.16Ω
IOUT=2A, for example,
D=VOUT/VCC=1.8/3.3=0.545
RON=0.545×0.20+(1-0.545)×0.16
=0.109+0.0728
=0.1818[Ω]
P=2
2×0.1818=0.7272W]
As RONP is greater than RONN in this IC, the dissipation increases as the ON duty becomes greater.
With the
consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed.
η=
VOUT×IOUT
Vin×Iin
×100[%]=
POUT
Pin
×100[%]=
POUT
POUT+PD
α
×100[%]
Vin
2×CRSS×IOUT×f
IDRIVE
3)PD(SW)=
(CRSS[F]:Reverse transfer capacitance of FET,IDRIVE[A]:Peak current of gate.)
0
25
50
75
100
125
150
0
2.0
3.0
4.0
②0.90W
①3.9W
105
1.0
③0.64W
Fig.27 Thermal derating curve
(SON008V5060)
P=IOUT
2×RON
RON=D×RONP+(1-D)RONN
D:ON duty (=VOUT/VCC)
RCOIL:DC resistance of coil
RONP:ON resistance of P-channel MOS FET
RONN:ON resistance of N-channel MOS FET
IOUT:Output current
Ambient temperature:Ta [℃]
①for SON008V5060
JEDEC 4 layer board 76.2×114.3×1.6mm
θj-a=32.1℃/W
②for SON008V5060
ROHM standard 1 layer board 70×70×1.6mm
θj-a=138.9℃/W
③ IC only
θj-a=195.3℃/W


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