Technical Note

6/8

BD63801EFV

www.rohm.com

2012.02 - Rev.A

© 2012 ROHM Co., Ltd. All rights reserved.

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Operation Notes

(1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may

result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open

mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,

consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.

(2) Power supply polarity

Connecting the power supply with a reverse polarity can damage IC. Take precautions when connecting the power

supply lines. An external diode can be connected to the input for extra protection.

(3) Power supply lines

PCB design should allow for low-impedance GND and supply lines. To minimize noise on these lines, the GND section

and supply lines of the digital and analog blocks should be routed separately on the PCB. Furthermore, for all power IC

supply terminals, a capacitor should be connected between the power supply and GND terminal. If using electrolytic

capacitors, note that their capacitance values may be reduced at lower temperatures.

(4) GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no

pins are at a voltage below the GND at any time, regardless of transient characteristics.

(5) Backside heat slag

The metal heat slag integrated on the backside of the IC is connected internally with the backside of the IC die.

Therefore, it should always be connected to GND. Connecting to any other potential may cause malfunction or

destruction of the IC.

(6) Thermal design

Use a thermal design that allows for a sufficient margin for the package’s rated power dissipation (Pd) under actual

operating conditions. Keep in mind that the packaging of this IC series has been designed with an exposed heat slag on

the backside of the package, and that this heat slag should be soldered completely to as broad a GND pattern as

possible (on both the base fin of the slag as well as the entire backside) to improve heat dissipation.

(7) Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in

damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by

poor soldering or foreign objects) may result in damage to the IC.

(8) Operation in strong electromagnetic fields

Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications

where strong electromagnetic fields may be present.

(9) ASO – Area of safe operation

When using the IC, ensure that operating conditions do not exceed absolute maximum ratings or ASO of the output

transistors.

(10) Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit, which is designed to force the motor output open if the IC’s

internal temperature exceeds Tjmax = 150°C. It is not designed to protect the IC from damage or guarantee its

operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit

is assumed.

TSD on temperature [°C] (Typ.)

Hysteresis Temperature [°C] (Typ.)

175

25

(11) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to

stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be

turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent

damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.