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ADA4528-1 Datasheet(PDF) 6 Page - Analog Devices |
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ADA4528-1 Datasheet(HTML) 6 Page - Analog Devices |
6 / 24 page ADA4638-1 Data Sheet Rev. 0 | Page 6 of 24 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5. Parameter Rating Supply Voltage 33 V Input Voltage1 ±VSY Input Current ±10 mA Differential Input Voltage ±VSY Output Short-Circuit Duration to GND Indefinite Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 300°C θJA is specified for a device soldered on a 4-layer JEDEC standard board with zero airflow. For LFCSP packages, the exposed pad is soldered to the board. Table 6. Thermal Resistance Package Type θJA θJC Unit 8-Lead SOIC 120 45 °C/W 8-Lead LFCSP 75 12 °C/W ESD CAUTION 1 Input voltage should always be limited to less than 30 V. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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