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SMDA03LCC Datasheet(PDF) 7 Page - Protek Devices |
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SMDA03LCC Datasheet(HTML) 7 Page - Protek Devices |
7 / 10 page Only One Name Means ProTek’Tion™ www.protekdevices.com 05074.R9 9/10 Page 7 SMDA03LC - SMDA24LCC APPLICATION INFORMATION FIGURE 2 - BIDIRECTIONAL COMMON-MODE EThERNET PROTECTION Circuit connectivity is as follow: • TPIN connected to Pin 5. • TPIP connected to Pin 6. • TPON connected to Pin 1. • TPOP connected to Pin 2. • Pins 3, 4, 7 and 8 connected to ground. CIRCUIT BOARD RECOMMENDATIONS Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended: • The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. • The path length between the TVS device and the protected line should be minimized. • All conductive loops including power and ground loops should be minimized. • The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. • Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 1 2 4 8 3 5 6 7 TPIP TPIN TPON TPOP |
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