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05074.R9 9/10

Page 7

SMDA03LC - SMDA24LCC

APPLICATION INFORMATION

FIGURE 2 - BIDIRECTIONAL COMMON-MODE EThERNET PROTECTION

Circuit connectivity is as follow:

• TPIN connected to Pin 5.

• TPIP connected to Pin 6.

• TPON connected to Pin 1.

• TPOP connected to Pin 2.

• Pins 3, 4, 7 and 8 connected to ground.

CIRCUIT BOARD RECOMMENDATIONS

Circuit board layout is critical for electromagnetic compatibility protection. The following guidelines are recommended:

• The protection device should be placed near the input terminals or connectors, the device will divert the transient current

immediately before it can be coupled into the nearby traces.

• The path length between the TVS device and the protected line should be minimized.

• All conductive loops including power and ground loops should be minimized.

• The transient current return path to ground should be kept as short as possible to reduce parasitic inductance.

• Ground planes should be used whenever possible. For multilayer PCBs, use ground vias.

1

2

4

8

3

5

6

7

TPIP

TPIN

TPON

TPOP