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AG312 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc. |
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AG312 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc. |
3 / 18 page Design with PIN Diodes Rev. V3 AG312 3 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Switching Speed Model The switching speed in any application depends on the driver circuit as well as the PIN diode. The primary PIN properties that influence switching speed may be ex- plained as follows: A PIN diode has two switching speeds from forward bias to reverse bias TFR, and from reverse bias to forward bias TRF. The diode characteristic that affects TFR is τ, carrier lifetime. The value of TFR may be computed from the forward current IF, and the initial reverse current IR, as follows: Figure 3 TRF depends primarily on I-region width, W, as indicated in the following chart which shows typical data: I-Width To 10 mA from To 50 mA from µm 10 V 100 V 10 V 100 V 10 V 100 V 175 7.0 µS 5.0 µS 3.0 µS 2.5 µS 2.0 µS 1.5 µS 100 2.5 µS 2.0 µS 1.0 µS 0.8 µS 0.6 µS 0.6 µS 50 0.5 µS 0.4 µS 0.3 µS 0.2 µS 0.2 µS 0.1 µS To 100 mA from Thermal Model The maximum allowable power dissipation, PD, is deter- mined by the following equation: where TJ is the maximum allowable junction temperature (usually 175°C) and TA is the ambient or heat sink tem- perature. Power dissipation may be computed as the product ot the RF current squared multiplied by the diode resistance, RS. For CW applications the value of thermal resistance, θ, used is the average thermal resistance, θAV. In most pulsed RF and microwave applications where the duty factor, DF, is less than 10 percent and the pulse width, tp, is less than the thermal time constant of the diode, good approximation of the effective value of θ in the above equation may be computed as follows: Where θ tp is the thermal impedance of the diode for the time interval corresponding to tp. The following diagram indicates how junction temperature is affected during a pulsed RF application. PIN Diode Applications Figure 4 |
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