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AG312 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc.

Part # AG312
Description  Design with PIN Diodes
Download  18 Pages
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

AG312 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc.

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Design with PIN Diodes
Rev. V3
AG312
3
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Switching Speed Model
The switching speed in any application depends on the
driver circuit as well as the PIN diode. The primary PIN
properties that influence switching speed may be ex-
plained as follows:
A PIN diode has two switching speeds from forward bias
to reverse bias TFR, and from reverse bias to forward
bias TRF. The diode characteristic that affects TFR is τ,
carrier lifetime. The value of TFR may be computed from
the forward current IF, and the initial reverse current IR,
as follows:
Figure 3
TRF depends primarily on I-region width, W, as indicated
in the following chart which shows typical data:
I-Width To 10 mA from To 50 mA from
µm
10 V
100 V
10 V
100 V
10 V
100 V
175
7.0 µS
5.0 µS
3.0 µS
2.5 µS
2.0 µS
1.5 µS
100
2.5 µS
2.0 µS
1.0 µS
0.8 µS
0.6 µS
0.6 µS
50
0.5 µS
0.4 µS
0.3 µS
0.2 µS
0.2 µS
0.1 µS
To 100 mA from
Thermal Model
The maximum allowable power dissipation, PD, is deter-
mined by the following equation:
where TJ is the maximum allowable junction temperature
(usually 175°C) and TA is the ambient or heat sink tem-
perature. Power dissipation may be computed as the
product ot the RF current squared multiplied by the diode
resistance, RS.
For CW applications the value of thermal resistance, θ,
used is the average thermal resistance, θAV.
In most pulsed RF and microwave applications where the
duty factor, DF, is less than 10 percent and the pulse
width, tp, is less than the thermal time constant of the
diode, good approximation of the effective value of θ in
the above equation may be computed as follows:
Where θ tp is the thermal impedance of the diode for the
time interval corresponding to tp.
The
following
diagram
indicates
how
junction
temperature is affected during a pulsed RF application.
PIN Diode Applications
Figure 4


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