Micrel, Inc.

SY88216L

July 2008

4

M9999-071108-C

hbwhelp@micrel.com or (408) 955-1690

Absolute Maximum Ratings

(1)

Lead Temperature (soldering, 20sec.) ..................... +260°C

Operating Ratings

(2)

Package Thermal Resistance

(3)

QFN

(

θ

(

ψ

DC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Current

Modulation and Bias currents

excluded

55

95

(4)

mA

Minimum Voltage Required at the

Driver Output, MOD+ and MOD-,

for Proper Operation

0.6

V

Minimum Voltage Required at the

Driver Output, BIAS+ and BIAS-,

for Proper Operation

0.8

V

Bias-ON Current

Voltage at Bias pin

≥ 0.8V

1

70

mA

Bias-OFF Current

Current at BIAS pin when /EN is

high or BEN is low

150

µA

Input Resistance at DIN+ and DIN-

Single ended

42.5

50

57.5

Ω

(DIN)

Differential Input Voltage Swing

100

2400

/EN Input Low

0.8

V

/EN Input High

2

V

/APCFAULT Output Low

0.5

V

/APCFAULT Output Leakage

100

µA

BEN+,

BEN-

Burst Mode Enable Signal

Single Ended

0.8

V

High Voltage

BEN+, BEN-

V

Low Voltage

BEN+, BEN-

-0.3

V

Input Voltage Swing

BEN+, BEN-

100

mV

(BEN)

Differential Input Voltage Swing

BEN+, BEN-

200

Maximum Voltage at PWRMON Pin

1.25

V

Current Range at MD Pin

50

1500

µA

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied

at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended

periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

ψ

4-layer and

θ