Micrel, Inc.

SY58620L

January 2006

6

M9999-012006-C

hbwhelp@micrel.com or (408) 955-1690

Absolute Maximum Ratings

(1)

Supply Voltage

Input Voltage

Source or Sink Current on

TXVT............................................................... ±100mA

LOS..................................................................... ±5mA

RXQ, /RXQ ....................................................... ±25mA

TXQ, /TXQ ........................................................ ±25mA

RXIN, /RXIN...................................................... ±10mA

TXIN, /TXIN....................................................... ±50mA

TXVREF-AC, VREF-CTRL ................................. ±2mA

Lead Temperature (soldering, 20sec.) ..................... 260°C

Operating Ratings

(2)

Supply Voltage

Package Thermal Resistance

(3)

QFN (

θ

Still-Air ....................................................50°C/W

QFN (

ψ

Junction-to-Board...................................30°C/W

DC Electrical Characteristics

(4)

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply

3

3.3

3.6

V

Transmit Power Supply

3

3.3

3.6

V

Receive Power Supply

3

3.3

3.6

V

Power Supply Current

100

150

mA

Receiver Input DC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

Input Resistance

(RXIN to VREF)

45

50

55

Ω

Input Resistance

(RXIN to /RXIN)

90

100

110

Ω

Input Voltage Swing

(RXIN, /RXIN)

See Figure 5a

AC-coupled

10

900

mV

Differential Input Voltage Swing

|RXIN - /RXIN|

See Figure 5b

AC-coupled

20

1800

mV

Internal Reference Voltage

-1.48

-1.32

-1.16

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

θ

values are determined for a 4-layer board in still-air, unless otherwise stated.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.