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SY58027UMG Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY58027UMG Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 10 page 3 Precision Edge® SY58027U Micrel, Inc. M9999-082707 hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings(1) Power Supply Voltage (VCC ) ...................... –0.5V to +4.0V Input Voltage (VIN) .......................................... –0.5V to VCC LVPECL Output Current (IOUT) Continuous .............................................................. 50mA Surge .................................................................... 100mA Termination Current(3) Source or sink current on VT ...................................... ±100mA Input Current Source or sink current on IN, /IN .......................... ±50mA Current (VREF-AC) Source or sink current on VREF-AC (3) ...................±1.5mA Lead Temperature (soldering, 20 sec.) ..................... 260°C Storage Temperature Range (TS ) ........... –65°C to +150°C Operating Ratings(2) Power Supply Voltage (VCC) ............... +2.375V to +2.625V ............................................................. +3.0V to +3.6V Ambient Temperature Range (TA) .............. –40°C to +85°C Package Thermal Resistance MLF® ( θ JA) Still-Air ............................................................. 35°C/W 500lpfm ........................................................... 28°C/W MLF® ( ψ JB) (4) Junction-to-board ............................................ 20°C/W Symbol Parameter Condition Min Typ Max Units VCC Power Supply VCC = 2.5V 2.375 2.5 2.625 V VCC = 3.3V 3.0 3.3 3.6 V ICC Power Supply Current No load, max. VCC. 100 140 mA RDIFF_IN Differential Input Resistance 80 100 120 ý (IN-to-/IN) RIN Input Resistance (IN-to-VT, /IN-to-VT) 4050 60ý VIH Input High Voltage (IN, /IN) Note 6 VCC–1.6 VCC V VIL Input Low Voltage (IN, /IN) 0 VIH –0.1 V VIN Input Voltage Swing (IN, /IN) See Figure 1a. 0.1 1.7 V VDIFF_IN Differential Input Voltage Swing See Figure 1b. 0.2 V |IN – /IN| VT IN In to VT (IN, /IN) 1.28 V VREF-AC Output Reference Voltage VCC–1.3 VCC–1.2 VCC–1.1 V Notes: 1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB. Ψ JB uses 4- layer θ JA in still air unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. VIH (min) not lower than 1.2V. DC ELECTRICAL CHARACTERISTICS(5) T A= –40°C to +85°C; Unless otherwise stated. |
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