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SY58017UMGTR Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY58017UMGTR Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 11 page 3 Precision Edge® SY58017U Micrel, Inc. M9999-082807 hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings(1) Power Supply Voltage (VCC ) ...................... –0.5V to +4.0V Input Voltage (VIN) ......................................... –0.5V to VCC CML Output Voltage (VOUT) ......... VCC –1.0V to VCC +0.5V Termination Current(3) Source or sink current on VT pin ........................ ±100mA Input Current Source or sink current on IN, /IN pin .................... ±50mA Lead Temperature (soldering, 20 sec.) ..................... 260°C Storage Temperature Range (TS ) ........... –65°C to +150°C Operating Ratings(2) Power Supply Voltage (VCC) ............... +2.375V to +2.625V ............................................................ +3.0V to +3.6V Ambient Temperature Range (TA) ............. –40°C to +85°C Package Thermal Resistance(4) MLF® (θJA) Still-Air ............................................................. 60°C/W MLF® (ψJB) Junction-to-Board ............................................ 38°C/W TA = –40°C to 85°C, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units VCC Power Supply Voltage VCC = 2.5V 2.375 2.5 2.625 V VCC = 3.3V 3.0 3.3 3.6 V ICC Power Supply Current No load, max. VCC (6) 55 70 mA RDIFF_IN Differential Input Resistance 80 100 120 Ω (IN0-to-/IN0, IN1-to-/IN1) RIN Input Resistance 40 50 60 Ω (IN0-to-VT0, /IN0-to-VT0, IN1-to-VT1, /IN1-to-VT1) VIH Input HIGH Voltage Note 7 VCC–1.6 VCC V (IN0, /IN0, IN1, /IN1) VIL Input LOW Voltage 0 VIH–0.1 V (IN0, /IN0, IN1, /IN1) VIN Input Voltage Swing See Figure 1a 0.1 1.7 V (IN0, /IN0, IN1, /IN1) VDIFF_IN Differential Input Voltage Swing See Figure 1b 0.2 V |IN0, /IN0|, |IN1, /IN1| VT IN IN to VT 1.28 V (IN0, /IN0, IN1, /IN1) Notes: 1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB. ψJB uses 4-layer θJA in still-air measurment, unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. Includes current through internal 50Ω pull-ups. 7. VIH (min) not lower than 1.2V. DC ELECTRICAL CHARACTERISTICS(5) |
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