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L1M-2N0S-10 Datasheet(PDF) 7 Page - Superworld Electronics |
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L1M-2N0S-10 Datasheet(HTML) 7 Page - Superworld Electronics |
7 / 10 page SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern If Use Wave soldering is there will be some risk. 8-2.3 Soldering Iron : 8-2.1 Lead Free Solder Re-flow : Note. by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for re-flow Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a) Preheat circuit and products to 150° C. b) 350° C tip temperature (max) 60~180s Figure 1. Re-flow Soldering : 3 times max 60~150s c) Never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. 150 Preheating Note : 8-2. Soldering e) Use a 20 watt soldering iron with tip diameter of 1.0mm d) 1.0mm tip diameter (max) Soldering cooling Natural under mechanical stress as warping the board. the mechanical stress to prevent failure. Products shall be positioned in the sideway direction against PC board should be designed so that products are not sufficient Figure 2. Iron Soldering times:1 times max G rad ual Cooling Over 1min. Time(sec.) 350 150 Preheating Soldering cooling Natural 20~40s 1.50 0.40 200 217 TP(260° C/40s max.) 4 80s max. 25 Within 4-5s Re-flow soldering temperatures below 240 degrees, there will be unwitting risk soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. f) Limit soldering time to 4~5sec. High Frequency Chip Inductor L1M SERIES 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information. |
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