SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 7

8. SOLDERING AND MOUNTING :

8-1. Recommended PC Board Pattern

If Use Wave soldering is there will be some risk.

8-2.3 Soldering Iron :

8-2.1 Lead Free Solder Re-flow :

Note.

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for re-flow

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150° C.

b) 350° C tip temperature (max)

60~180s

Figure 1. Re-flow Soldering : 3 times max

60~150s

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.

150

Preheating

Note :

8-2. Soldering

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

d) 1.0mm tip diameter (max)

Soldering

cooling

Natural

under mechanical stress as warping the board.

the mechanical stress to prevent failure.

Products shall be positioned in the sideway direction against

PC board should be designed so that products are not sufficient

Figure 2. Iron Soldering times：1 times max

G rad ual

Cooling

Over 1min.

Time(sec.)

350

150

Preheating

Soldering

cooling

Natural

20~40s

1.50

0.40

200

217

TP(260° C/40s max.)

4 80s max.

25

Within 4-5s

Re-flow soldering temperatures below 240 degrees, there will be unwitting risk

soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

f) Limit soldering time to 4~5sec.

High Frequency Chip Inductor

L1M SERIES

10.11.2011

NOTE : Specifications subject to change without notice. Please check our website for latest information.