PG. 6

8. SOLDERING AND MOUNTING :

8-1. Recommended PC Board Pattern

air soldering tools.

8-2.2 Soldering Iron :

8-2.1 Lead Free Solder Re-flow :

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature for Ferrite chip bead (max)

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.

Note :

8-2. Soldering

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4-5 secs.

d) 1.0mm tip diameter (max)

under mechanical stress as warping the board.

the mechanical stress to prevent failure.

Products shall be positioned in the sideway direction against

PC board should be designed so that products are not sufficient

Preheating

TP(260°C/40s max.)

60~180s

4 80s max.

Figure 1. Re-flow Soldering:3 times max

150

25

200

217

Time(sec.)

Within4 ~5s

G rad ual

Cooling

O ve r 60s.

Figure 2. Wave Soldering:1 times max

cooling

60~150s

20~40s

Soldering

Natural

cooling

150

350

Preheating

Soldering

Natural

SUPERWORLD ELECTRONICS (S) PTE LTD

1.50

0.40

SUPERWORLD ELECTRONICS (S) PTE LTD

Re-flow soldering temperatures below 240 degrees, there will be unwitting risk

If Use Wave soldering is there will be some risk.

Note.

Ferrite Chip Bead

Z1G Series

10.11.2011

NOTE : Specifications subject to change without notice. Please check our website for latest information.