CC2540F128, CC2540F256

SWRS084C

– OCTOBER 2010 – REVISED NOVEMBER 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

(1)

MIN

MAX

UNIT

Supply voltage

All supply pins must have the same voltage

–0.3

3.9

V

–0.3

VDD + 0.3,

Voltage on any digital pin

V

≤ 3.9

Input RF level

10

dBm

Storage temperature range

–40

125

°C

All pads, according to human-body model, JEDEC STD 22, method A114

2

kV

According to charged-device model, JEDEC STD 22, method C101

750

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

–40

85

°C

Operating supply voltage

2

3.6

V

ELECTRICAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Power mode 1. Digital regulator on; 16-MHz RCOSC and

32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD

235

and sleep timer active; RAM and register retention

Power mode 2. Digital regulator off; 16-MHz RCOSC and

µA

32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and

0.9

Core current consumption

sleep timer active; RAM and register retention

Power mode 3. Digital regulator off; no clocks; POR active;

0.4

RAM and register retention

Low MCU activity: 32-MHz XOSC running. No radio or

6.7

mA

peripherals. No flash access, no RAM access.

Timer 1. Timer running, 32-MHz XOSC used

90

μA

Timer 2. Timer running, 32-MHz XOSC used

90

μA

Peripheral current consumption

Timer 3. Timer running, 32-MHz XOSC used

60

μA

Timer 4. Timer running, 32-MHz XOSC used

70

μA

peripheral unit activated)

Sleep timer, including 32.753-kHz RCOSC

0.6

μA

ADC, when converting

1.2

mA

4

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