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CL-824-MU1W1-T Datasheet(PDF) 10 Page - CITIZEN ELECTRONICS CO., LTD. |
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CL-824-MU1W1-T Datasheet(HTML) 10 Page - CITIZEN ELECTRONICS CO., LTD. |
10 / 12 page 10/12 9. Precautions 9-1. Soldering 1) Following soldering paste is recommended Melting temperature : 216 ~ 220C. Composition : Sn 3.5Ag 0.75Cu 2) The temperature profile at the top surface of the parts is recommended as shown below. 3) It is requested that products should be handled after their temperature has dropped down to the normal room temperature 9-2. Washing (1) When washing after soldering is needed, following conditions are requested. a) Washing solvent: Pure Water b) Temperature, time: 50C or less × 30 seconds max. c) Ultrasonic washing: 300W or less 9-3. Other directions (1) It is requested to avoid any stress added to the resin portion while it is heated. (2) It is requested to avoid any friction by sharp metal nail etc. to the resin portion. Symbol (1) Lead free soldering DATA SHEET CITILED Name CL-824-MU1W1 CITIZEN ELECTRONICS CO.,LTD. JAPAN 140sec 160 ~ 180°C 4 °C/sec. Max Time 4 °C/sec. Max 260 °C Max 220 °C 60 ~ 70sec 3 sec. Max Ref.CE-P1040 04/11 |
Similar Part No. - CL-824-MU1W1-T_11 |
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Similar Description - CL-824-MU1W1-T_11 |
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