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CL-L251-C4N1-C Datasheet(PDF) 9 Page - CITIZEN ELECTRONICS CO., LTD. |
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CL-L251-C4N1-C Datasheet(HTML) 9 Page - CITIZEN ELECTRONICS CO., LTD. |
9 / 11 page 9/11 8. Precautions (continued) Symbol Name CL-L251-C4N1-C CITIZEN ELECTRONICS CO.,LTD. JAPAN CITILED ambient temperature conditions or power dissipation. Thus, drive conditions should be - Factors responsible for an increase in temperature include heat generation attributed to Please ensure that heat generation is not in excess of the absolute maximum rating. (Refer to 4-1 Performance) taken into consideration, depending on ambient temperature (Ta). (Recommended condition in a case of lead-free solder condition) - Soldering shall be implemented using a soldering bit of 40W or less with a temperature 11. Recommended soldering condition (This product is not adaptable to reflow process) - As this product is designed with consideration of the heat release property of module, a heat release design is required to use this product efficiently. 8. Please be aware that this product should not come into contact with any other parts - Please design a circuit that prevents any reverse voltage (excess current) from being applied to this product instantaneously when the circuit is ON or OFF. 7. Lighting at a low current When a minimum current is applied, LED dice may look different in their brightness due to in assembled status. DATA SHEET - Contacts number of soldering bit should be within twice for each terminal as a correction. A minimum current value of lighting of all dice is 40mA. 9. Drive circuit between each package is recommended. And when two or more LED packages are connected, the series connection - Manual soldering 350°C or less within 3.5 seconds for one land. - A constant current circuit is recommended as a drive circuit. - No external force shall be applied to resin part during soldering. * Citizen Electronics cannot guarantee if usage exceeds this recommended conditions. Please use it after sufficient verification is carried out on your own risk if necessary. - Regarding soldering correction, above conditions shall be used. - Next process of soldering should be carried out after the product has returned to ambient - For soldering correction 10. Heat generation the individual difference of the LED element, and it is not a failed product. Ref.CE-P1170 05/11 R1(0711) |
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