9. Precautions

9-1. Soldering

(1) Lead free soldering

1) Following soldering paste is recommended

Melting temperature: 216 ~ 220 C.

Composition: Sn / 3.5Ag / 0.75Cu

2) The temperature profile at the top surface of the parts is recommended as shown

below.

3) It is requested that products should be handled after their temperature has dropped

down to the normal room temperature

9-2. Washing

(1) When washing after soldering is needed, following conditions are requested.

a) Washing solvent: Pure Water

b) Temperature, time: 50 C or less × 30 seconds max.

or 30 C or less × 3 minutes max.

c) Ultrasonic washing: 300W or less

9-3. Other directions

(1) It is requested to avoid any stress added to the resin portion while it is heated.

(2) It is requested to avoid any friction by sharp metal nail etc. to the resin portion.

(3) For outdoor use, necessary measures should be taken to prevent water,

moisture and salt air damage.

This product is NOT designed with following conditions in mind.

In water, oil, medicament, organic solvent and dust-laden environment.

CITIZEN ELECTRONICS CO.,LTD. JAPAN

DATA SHEET

Symbol

CITILED

Name

CL-L270-MU1L1-A1

9 / 12

140sec

Time

3

sec

. Max

Ref.CE-P1400

08/11