R04

www.clare.com

6

CPC1708

4

Manufacturing Information

4.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified

all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint

industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our

products to the maximum conditions set forth in the standard, and guarantee proper operation of our

devices when handled according to the limitations and information in that standard as well as to any limitations set

forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to

the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

4.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard

JESD-625.

4.3 Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of

J-STD-020 must be observed.

4.4 Board Wash

Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is

acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated

products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.

Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic

energy should not be used.

Device

Moisture Sensitivity Level (MSL) Rating

CPC1708J

MSL 1

Device

Maximum Temperature x Time

CPC1708J

245°C for 30 seconds

RoHS

2002/95/EC