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CPC1777J Datasheet(PDF) 1 Page - Clare, Inc.

Part # CPC1777J
Description  i4-PAC??DC Power Relay
Download  7 Pages
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Manufacturer  CLARE [Clare, Inc.]
Direct Link  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC1777J Datasheet(HTML) 1 Page - Clare, Inc.

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e3
RoHS
2002/95/EC
DS-CPC1777 - R05
www.clare.com
1
Characteristics
Features
4.6A
DC Load Current with 5°C/W Heat Sink
Low 0.5
Ω On-Resistance
600V
P Blocking Voltage
2500V
rms Input/Output Isolation
Low Thermal Resistance (0.35 °C/W)
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Utility Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Certified Component: File E69938
Pin Configuration
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new family
of High Power Solid State Relays. As part of this new
family, the CPC1777 single-pole normally open
(1-Form-A) DC Solid State Relay employs optically
coupled MOSFET technology to provide 2500Vrms of
input to output isolation.
The output, constructed with an efficient MOSFET
switch and photovoltaic die, uses Clare’s patented
OptoMOS architecture while the input, a GaAlAs
infrared LED, provides the optically coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique i4-PAC package pioneered by IXYS
enables solid state relays to achieve the highest load
current and power ratings. This package features an
IXYS unique process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low thermal resistance (0.35°C/W).
Ordering Information
Switching Characteristics
Parameter
Rating
Units
Blocking Voltage
600
VP
Load Current, TA=25°C:
With 5°C/W Heat Sink
4.6
ADC
No Heat Sink
1.5
On-Resistance
0.5
Ω
RθJC
0.35
°C/W
12
3
4
+-
-
+
Part
Description
CPC1777J
i4-PAC Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1777
Single-Pole, Normally Open
i4-PAC™ DC Power Relay


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