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CPC7557N Datasheet(PDF) 4 Page - Clare, Inc. |
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CPC7557N Datasheet(HTML) 4 Page - Clare, Inc. |
4 / 5 page R02 www.clare.com 4 CPC7557 3 Manufacturing Information 3.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. 3.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 3.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. 3.4 Board Wash Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. The use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Device Moisture Sensitivity Level (MSL) Rating CPC7557N MSL 1 Device Maximum Temperature x Time CPC7557N 260 C for 30 seconds RoHS 2002/95/EC e3 Pb |
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