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BSC042N03MSG Datasheet(PDF) 5 Page - Analog Devices |
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BSC042N03MSG Datasheet(HTML) 5 Page - Analog Devices |
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5 / 40 page  Data Sheet ADP1878/ADP1879 Rev. A | Page 5 of 40 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VREG to PGND, GND −0.3 V to +6 V VIN, EN, PGOOD to PGND −0.3 V to +28 V FB, COMP, RES, SS to GND −0.3 V to (VREG + 0.3 V) DRVL to PGND −0.3 V to (VREG + 0.3 V) SW to PGND −2.0 V to +28 V BST to SW −0.6 V to (VREG + 0.3 V) BST to PGND −0.3 V to +28 V DRVH to SW −0.3 V to VREG PGND to GND ±0.3 V PGOOD Input Current 35 mA θJA (14-Lead LFCSP_WD) 4-Layer Board 30°C/W Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Maximum Soldering Lead Temperature (10 sec) 300°C Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to PGND. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Boundary Condition In determining the values given in Table 2 and Table 3, natural convection is used to transfer heat to a 4-layer evaluation board. Table 3. Thermal Resistance Package Type θJA Unit θJA (14-Lead LFCSP_WD) 4-Layer Board 30 °C/W ESD CAUTION Stresses a bove those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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