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MAX2694EWS+T Datasheet(PDF) 10 Page - Maxim Integrated Products |
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MAX2694EWS+T Datasheet(HTML) 10 Page - Maxim Integrated Products |
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10 / 11 page  GPS/GNSS Low-Noise Amplifiers 10 Applications Information A properly designed PCB is essential to any RF micro- wave circuit. Use controlled-impedance lines on all high-frequency inputs and outputs. Bypass VCC with decoupling capacitors located close to the device. For long VCC lines, it may be necessary to add decoupling capacitors. Locate these additional capacitors further away from the device package. Proper grounding of the GND bump is essential. If the PCB uses a topside RF ground, connect it directly to the GND bump. For a board where the ground is not on the component layer, connect the GND bump to the board with multiple vias close to the package. Refer to www.maxim-ic.com/datasheet/index.mvp/id/6932/t/do for the MAX2687/MAX2689/MAX2694 EV kit schematic, Gerber data, PADS layout file, and BOM information. Chip Information PROCESS: SiGe BiCMOS Table 6. MAX2694 Typical Noise Parameters (VCC = 2.85V, TA = +25NC) +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. Ordering Information Package Information For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. FREQUENCY (MHz) FMIN (dB) |GOPT| |GOPT| ANGLE RN (I) 1550 0.75 0.44 48 9.06 1560 0.75 0.44 48 9.04 1570 0.75 0.44 48 9.02 1575 0.75 0.43 49 9.01 1580 0.75 0.43 49 9.00 1590 0.75 0.43 49 8.98 1600 0.75 0.43 49 8.96 PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 4 WLP W40A0+1 21-0480 Refer to Application Note 1891 PART TEMP RANGE PIN-PACKAGE MAX2687EWS+T -40NC to +85NC 4 WLP MAX2689EWS+T -40NC to +85NC 4 WLP MAX2694EWS+T -40NC to +85NC 4 WLP |
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