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MAX5965A Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX5965A Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 54 page High-Power, Quad, Monolithic, PSE Controllers for Power over Ethernet 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VAGND = 32V to 60V, VEE = 0V, VDD to VDGND = +3.3V, all voltages are referenced to VEE, unless otherwise noted. Typical values are at VAGND = +48V, VDGND = +48V, VDD = (VDGND + 3.3V), TA = +25°C. Currents are positive when entering the pin and negative other- wise.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Voltages referenced to VEE, unless otherwise noted.) AGND, DGND, DET_, VDD, RESET, A3–A0, SHD_, OSC, SCL, SDAIN, AUTO .............................................-0.3V to +80V OUT_........................................................-12V to (AGND + 0.3V) GATE_ (internally clamped) (Note 1) ..................-0.3V to +11.4V SENSE_ ..................................................................-0.3V to +24V VDD, RESET, MIDSPAN, A3–A0, SHD_, OSC, SCL, SDAIN and AUTO to DGND ..................................-0.3V to +7V INT and SDAOUT to DGND....................................-0.3V to +12V Maximum Current into INT, SDAOUT, DET_ .......................80mA Maximum Power Dissipation (TA = +70°C) 36-Pin SSOP (derate 17.4mW/°C above +70°C) .....1388.9mW Operating Temperature Ranges: MAX5965A/MAX5965B_EAX ...…………………-40°C to +85°C MAX5965A/MAX5965B_UAX ...............................0°C to +85°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Note 1: GATE_ is internally clamped to 11.4V above VEE. Driving GATE_ higher than 11.4V above VEE may damage the device. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES VAGND VAGND - VEE 32 60 VDGND 060 VDD to VDGND, VDGND = VAGND 2.4 3.6 Operating Voltage Range VDD VDD to VDGND, VDGND = VEE 3.0 3.6 V IEE VOUT_ = VEE, VSENSE_ = VEE, DET_ = AGND, all logic inputs open, SCL = SDAIN = VDD. INT and SDAOUT unconnected. Measured at AGND in power mode after GATE_ pullup 4.8 6.8 Supply Currents IDIG All logic inputs high, measured at VDD 0.2 0.4 mA GATE DRIVER AND CLAMPING GATE_ Pullup Current IPU Power mode, gate drive on, VGATE_ = VEE (Note 3) -40 -50 -65 µA Weak GATE_ Pulldown Current IPDW SHD_ = DGND, VGATE_ = VEE + 10V 42 µA Maximum Pulldown Current IPDS VSENSE_ = 600mV, VGATE_ = VEE + 2V 100 mA External Gate Drive VGS VGATE_ - VEE, power mode, gate drive on, IPU = 1µA 9 10 11.5 V |
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