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MAX14778 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX14778
Description  Dual ±25V Above- and Below-the-Rails 4:1 Analog Multiplexer
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX14778 Datasheet(HTML) 2 Page - Maxim Integrated Products

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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
(All voltages referenced to GND.)
VDD..........................................................................-0.3V to +6V
VP ...........................-0.3V to the lesser of +52V and (VN + 70V)
VN ................The lesser of (VDD - 40V) and (VP - 70V) to +0.3V
VP to VN.................................................................-0.3V to +70V
ENA, ENB, SA_, SB_ ................................ -0.3V to (VDD + 0.3V)
A_, ACOM, B_,
BCOM .. (VN - 0.3V) to the lesser of (VP + 0.3V) and (VN + 52V)
Continuous Current Through Switch ............................. ±500mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 33.3mW/NC above +70NC)...............2666.7mW
Operating Temperature Range.......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ..........30NC/W
Junction-to-Case Thermal Resistance (BJC) .................2NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VDD = 5V, TA = +25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Supply Voltage Range
VDD
3.0
5.5
V
Supply Current
IDD
ENA = ENB = high
VDD P VDDTH
4.27
10
mA
VDD > VDDTH
2.54
6
VENA = VENB = VDD/2
VDD P VDDTH
4.31
10
VDD > VDDTH
2.59
6
Charge-Pump Threshold
VDDTH
(Note 3)
4.64
V
Analog Signal Range
VIN
Figure 1, switch open or closed
-25
+25
V
Continuous Current
Through Switch
ICOM
-300
+300
mA
On-Resistance
RON
Figure 1, ICOM = Q300mA, VIN = Q25V
0.84
1.5
On-Resistance Flatness
RFLAT(ON)
Figure 1, -25V P VIN P +25V,
ICOM = Q300mA
3
mΩ
A_, B_ Off-Leakage
Current
IA(OFF),
IB(OFF)
Figure 2, VIN = 25V, VOUT = 0V
-200
+200
nA
ACOM, BCOM
Off-Leakage Current
IACOM(OFF),
IBCOM(OFF)
Figure 2, VOUT = 15V, VIN = 0V
-1
+1
F
A
A_, B_ On-Leakage
Current
IA(ON),
IB(ON)
Figure 2, VIN = Q25V, ACOM or BCOM
is unconnected
-1
+1
F
A


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