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MAX14778 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX14778 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 15 page ����������������������������������������������������������������� Maxim Integrated Products 2 MAX14778 Dual ±25V Above- and Below-the-Rails 4:1 Analog Multiplexer (All voltages referenced to GND.) VDD..........................................................................-0.3V to +6V VP ...........................-0.3V to the lesser of +52V and (VN + 70V) VN ................The lesser of (VDD - 40V) and (VP - 70V) to +0.3V VP to VN.................................................................-0.3V to +70V ENA, ENB, SA_, SB_ ................................ -0.3V to (VDD + 0.3V) A_, ACOM, B_, BCOM .. (VN - 0.3V) to the lesser of (VP + 0.3V) and (VN + 52V) Continuous Current Through Switch ............................. ±500mA Continuous Power Dissipation (TA = +70NC) TQFN (derate 33.3mW/NC above +70NC)...............2666.7mW Operating Temperature Range.......................... -40NC to +85NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ...............................+300NC Soldering Temperature (reflow) ......................................+260NC TQFN Junction-to-Ambient Thermal Resistance (BJA) ..........30NC/W Junction-to-Case Thermal Resistance (BJC) .................2NC/W ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) ELECTRICAL CHARACTERISTICS (VDD = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VDD = 5V, TA = +25NC.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS Supply Voltage Range VDD 3.0 5.5 V Supply Current IDD ENA = ENB = high VDD P VDDTH 4.27 10 mA VDD > VDDTH 2.54 6 VENA = VENB = VDD/2 VDD P VDDTH 4.31 10 VDD > VDDTH 2.59 6 Charge-Pump Threshold VDDTH (Note 3) 4.64 V Analog Signal Range VIN Figure 1, switch open or closed -25 +25 V Continuous Current Through Switch ICOM -300 +300 mA On-Resistance RON Figure 1, ICOM = Q300mA, VIN = Q25V 0.84 1.5 Ω On-Resistance Flatness RFLAT(ON) Figure 1, -25V P VIN P +25V, ICOM = Q300mA 3 mΩ A_, B_ Off-Leakage Current IA(OFF), IB(OFF) Figure 2, VIN = 25V, VOUT = 0V -200 +200 nA ACOM, BCOM Off-Leakage Current IACOM(OFF), IBCOM(OFF) Figure 2, VOUT = 15V, VIN = 0V -1 +1 F A A_, B_ On-Leakage Current IA(ON), IB(ON) Figure 2, VIN = Q25V, ACOM or BCOM is unconnected -1 +1 F A |
Similar Part No. - MAX14778_12 |
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Similar Description - MAX14778_12 |
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