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BQ24166YFFR Datasheet(PDF) 9 Page - Texas Instruments

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Part # BQ24166YFFR
Description  2.5A, Dual-Input, Single Cell Switch Mode Li-Ion Battery Charger with Power Path
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

BQ24166YFFR Datasheet(HTML) 9 Page - Texas Instruments

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bq24165
bq24166
bq24167
www.ti.com
SLUSAP4A – DECEMBER 2011 – REVISED MARCH 2012
PIN FUNCTIONS (continued)
PIN NUMBER
PIN
bq24165
bq24166/7
I/O
DESCRIPTION
NAME
YFF
RGE
YFF
RGE
Gate Drive Supply. DRV is the bias supply for the gate drive of the internal
MOSFETs. bypass DRV to PGND with a 1
μF ceramic capacitor. DRV may be
DRV
F7
6
F7
6
O
used to drive external loads up to 10mA. DRV is active whenever the input is
connected and VSUPPLY > VUVLO and VSUPPLY > (VBAT + VSLP)
Battery Connection. Connect to the positive terminal of the battery.
BAT
G1–G4
11, 12
G1–G4
11, 12
I/O
Additionally, bypass BAT to GND with at least a 1
μF capacitor.
Battery Pack NTC Monitor. Connect TS to the center tap of a resistor divider
from DRV to GND. The NTC is connected from TS to GND. The TS function
in the bq24166 provides 2 thresholds for Hot/ Cold shutoff, while the bq24167
TS
G5
9
I
has 2 additional thresholds for JEITA compliance. See the NTC Monitor
section for more details on operation and selecting the resistor values.
Connect TS to DRV to disable the TS function.
Charge Status Open Drain Output. CHG is pulled low when a charge cycle
starts and remains low while charging. CHG is high impedance when the
CHG
G6
8
G6
8
O
charging terminates and when no supply exists. CHG does not indicate
recharge cycles.
Charge Current Programming Input. Connect a resistor from ISET to GND to
ISET
G7
5
G7
5
I
program the fast charge current. The charge current is programmable from
550mA to 2.5A.
There is an internal electrical connection between the exposed thermal pad
and the PGND pin of the device. The thermal pad must be connected to the
Thermal
Pad
Pad
same potential as the PGND pin on the printed circuit board. Do not use the
Pad
thermal pad as the primary ground input for the device. PGND pin must be
connected to ground at all times.
Copyright © 2011–2012, Texas Instruments Incorporated
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Product Folder Link(s): bq24165 bq24166 bq24167


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