bq294602, bq294604

SLUSAS0B – DECEMBER 2011 – REVISED MARCH 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PACKAGE

TAPE AND REEL

TAPE AND REEL

PART NUMBER

PACKAGE

OVP (V)

DELAY TIME (S)

DESIGNATOR

(LARGE)

(SMALL)

bq294602

4.35

4.0

bq294602DRVR

bq294602DRVT

bq294604

4.35

6.5

bq294604DRVR

bq294604DRVT

4.45

4.0

bq294622DRVR

bq294622DRVT

–40°C to

SON-6

DRV

110°C

4.45

6.5

bq294624DRVR

bq294624DRVT

4.225

4.0

bq294682DRVR

bq294682DRVT

4.225

6.5

bq294684DRVR

bq294684DRVT

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder on ti.com (www.ti.com).

(2)

Product Preview only

THERMAL INFORMATION

bq2946xy

SON

UNITS

6 PINS

Junction-to-ambient thermal resistance

186.4

Junction-to-case(top) thermal resistance

90.4

Junction-to-board thermal resistance

110.7

°C/W

Junction-to-top characterization parameter

96.7

Junction-to-board characterization parameter

90

Junction-to-case(bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Link(s): bq294602 bq294604