bq294502, bq294504, bq294512, bq294515

bq294522, bq294524, bq294532, bq294562

bq294572, bq294582, bq294592

SLUSAJ3C – SEPTEMBER 2011 – REVISED MAY 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PACKAGE

TAPE AND REEL

TAPE AND REEL

PART NUMBER

PACKAGE

OVP (V)

DELAY TIME (S)

DESIGNATOR

(LARGE)

(SMALL)

bq294502

4.35

4.0

bq294502DRVR

bq294502DRVT

bq294504

4.35

6.5

bq294504DRVR

bq294504DRVT

bq294512

4.40

4.0

bq294512DRVR

bq294512DRVT

bq294515

4.425

4.0

bq294515DRVR

bq294515DRVT

bq294522

4.45

4.0

bq294522DRVR

bq294522DRVT

bq294524

4.45

6.5

bq294524DRVR

bq294524DRVT

–40°C to

SON-6

DRV

110°C

bq294532

4.50

4.0

bq294532DRVR

bq294532DRVT

bq294562

4.25

4.0

bq294562DRVR

bq294562DRVT

bq294572

4.00

4.0

bq294572DRVR

bq294572DRVT

bq294582

4.225

4.0

bq294582DRVR

bq294582DRVT

4.225

6.5

bq294584DRVR

bq294584DRVT

bq294592

4.30

4.0

bq294592DRVR

bq294592DRVT

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder on ti.com (www.ti.com).

(2)

Product Preview only

THERMAL INFORMATION

bq2945xy

SON

UNITS

6 PINS

Junction-to-ambient thermal resistance

186.4

Junction-to-case(top) thermal resistance

90.4

Junction-to-board thermal resistance

110.7

°C/W

Junction-to-top characterization parameter

96.7

Junction-to-board characterization parameter

90

Junction-to-case(bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Copyright © 2011–2012, Texas Instruments Incorporated

Product Folder Link(s): bq294502 bq294504 bq294512 bq294515 bq294522 bq294524 bq294532 bq294562

bq294572 bq294582 bq294592