TPS799L

SBVS191 – APRIL 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

TPS799Lxx yyy z

XX is nominal output voltage (for example, 57 = 5.7V).

YYY is package designator.

Z is package quantity.

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

MIN

MAX

UNIT

IN

–0.3

+7.0

V

EN

–0.3

V

OUT

–0.3

V

Current

OUT

Internally limited

mA

–55

+150

°C

Temperature

–55

+150

°C

Human body model (HBM) QSS 009-105 (JESD22-A114A)

2

kV

Electrostatic discharge

Charge device model (CDM) QSS 009-147 (JESD22-C101B.01)

500

V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-

maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

(3)

ESD testing is performed according to the respective JESD22 JEDEC standard.

THERMAL INFORMATION

TPS799L

YZY (WCSP)

UNITS

5 PINS

Junction-to-ambient thermal resistance

143.3

Junction-to-case (top) thermal resistance

1.1

Junction-to-board thermal resistance

84.7

°C/W

Junction-to-top characterization parameter

3.8

Junction-to-board characterization parameter

84.4

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

2

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