Thermal

Shutdown

10kW

Current

Limit

Bandgap

IN

EN

OUT

EEPROM

Logic

Active

Pull-

Down

GND

OUT

GND

(1)

IN

GND

(1)

EN

1

2

3

5

4

IN

GND

(1)

EN

6

5

4

OUT

N/C

GND

(1)

1

2

3

Thermal

Pad

(2)

TPS782xx

SBVS115B – AUGUST 2008 – REVISED MAY 2010

www.ti.com

FUNCTIONAL BLOCK DIAGRAM

PIN CONFIGURATIONS

DDC PACKAGE

DRV PACKAGE

TSOT23-5

2mm x 2mm SON-6

(TOP VIEW)

(TOP VIEW)

(1)

All ground pins must be connected to ground for proper operation.

(2)

It is recommended that the thermal pad be grounded.

Table 1. PIN DESCRIPTIONS

PIN

NAME

DRV

DDC

DESCRIPTION

Regulated output voltage pin. A small (1mF) ceramic capacitor is needed from this pin to

OUT

1

5

ground to assure stability. See the Input and Output Capacitor Requirements in the

Application Information section for more details.

N/C

2

—

Not connected.

Driving the enable pin (EN) over 1.2V turns ON the regulator. Driving this pin below 0.4V

EN

4

3

puts the regulator into shutdown mode, reducing operating current to 18nA typical.

GND

3, 5

2, 4

ALL ground pins must be tied to ground for proper operation.

Input pin. A small capacitor is needed from this pin to ground to assure stability. Typical input

IN

6

1

capacitor = 1.0mF. Both input and output capacitor grounds should be tied back to the IC

ground with no significant impedance between them.

Thermal pad

Thermal pad

—

It is recommended that the thermal pad on the SON-6 package be connected to ground.

4

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