Sensors

4

Freescale Semiconductor, Inc.

MMA26xxNKW

1

Pin Connections

Figure 4. Block Diagram

Table 1. Pin Description

Pin

Pin

Name

Formal Name

Definition

1

TEST2

Test Pin

This pin must be left unconnected in the application.

2

TEST3

Test Pin

This pin must be grounded in the application.

3

TEST1

Test Pin

This pin must be grounded in the application.

4

BUSRTN

Ground

This pin is the common return for power and signalling.

5

PCM

PCM

Output

This pin provides a 4 MHz PCM signal proportional to the acceleration data for test purposes. The output can be enabled or

disabled via OTP. If unused, this pin must be left unconnected in the application. Reference Section 3.5.3.6.

6

VSSB

Ground

This pin must be grounded in the application.

7

BUSIN

Supply /

Comm

This pin is connected to the DSI positive bus node and provides the power supply and communication to the system master.

8

HCAP

Hold Capacitor

This pin rectifies the supply voltage on the BUSIN pin to create the supply voltage for the device. An external capacitor must

be connected between this pin and the BUSRTN pin to store energy for operation during master communication signalling.

9

Digital

Supply

This pin is connected to the power supply for the internal digital circuitry. An external capacitor must be connected between

10

TEST4

Test Pin

This pin must be grounded in the application.

11

Analog

Supply

This pin is connected to the power supply for the internal analog circuitry. An external capacitor must be connected between

12

VSSA

Analog GND

This pin is the power supply return node for analog circuitry.

13

TEST5

Test Pin

This pin enables test mode, and provides the SPI programming voltage in test mode. This pin is must be grounded in the

application.

14

TEST6

Test Pin

This pin must be grounded in the application.

15

TEST7

Test Pin

This pin must be grounded in the application.

16

Digital GND

This pin is the power supply return node for the digital circuitry.

17

PAD

Die Attach Pad

This pin is the die attach flag, and should be connected to VSS in the application. Reference Section 5.

Corner

Pads

Corner Pads

TEST2

BUSRTN

TEST4

TEST3

TEST1

1

2

3

4

5

6

7

8

12

11

10

9

16 15 14 13

17