2

RF Device Data

Freescale Semiconductor, Inc.

MMA20312BT1

Application Circuit)

Characteristic

Symbol

Min

Typ

Max

Unit

23.6

27.2

—

dB

Input Return Loss (S11)

IRL

—

--10.7

—

dB

Output Return Loss (S22)

ORL

—

--15.5

—

dB

Power Output @ 1dB Compression, CW

P1dB

—

28.2

—

dBm

Third Order Output Intercept Point, Two--Tone CW

OIP3

—

44.5

—

dBm

Noise Figure

NF

—

3.3

—

dB

62.5

70

77

mA

—

5

—

V

Table 5. ESD Protection Characteristics

Test Methodology

Class

Human Body Model (per JESD22--A114)

0, rated to 150 V

Machine Model (per EIA/JESD22--A115)

A

Charge Device Model (per JESD22--C101)

III

Table 6. Moisture Sensitivity Level

Test Methodology

Rating

Package Peak Temperature

Unit

Per JESD22--A113, IPC/JEDEC J--STD--020

3

260

°C

1. Specified data is based on performance of soldered down part in W--CDMA application circuit.

2. For reliable operation, the junction temperature should not exceed 150°C.

Figure 1. Functional Block Diagram

Figure 2. Pin Connections

19

28

37

12

11

10

45

6

GND GND GND

BIAS

CIRCUIT

BIAS

CIRCUIT

GND

GND

GND