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SP211EET Datasheet(PDF) 9 Page - Sipex Corporation

Part # SP211EET
Description  5V High Performance RS232 Transceivers
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Manufacturer  SIPEX [Sipex Corporation]
Direct Link  http://www.sipex.com
Logo SIPEX - Sipex Corporation

SP211EET Datasheet(HTML) 9 Page - Sipex Corporation

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9
SP207EDS/09
SP207E Series High Performance Transceivers
© Copyright 2000 Sipex Corporation
WAKEUP FUNCTION
The SP213E has a wake–up feature that keeps
two receivers (R
4 and R5) in an enabled state
when the device is in the shutdown mode. With
only the receivers active during shutdown, the
devices draw 5–10
µA of supply current.
A typical application of this function would be
where a modem is interfaced to a computer in a
power–down mode. The ring indicator signal
from the modem could be passed through an
active receiver in the SP213E that is itself in the
shutdown mode. The ring indicator signal would
propagate through the SP213E to the power
management circuitry of the computer to power
up the microprocessor and the SP213E drivers.
After the supply voltage to the SP213E reaches
+5.0V, the SHUTDOWN pin can be disabled,
taking the SP213E out of the shutdown mode.
All receivers that are active during shutdown
maintain 500mV (typ.) of hysteresis.
ESD TOLERANCE
The SP207E Family incorporates ruggedized
ESD cells on all driver output and receiver input
pins. The ESD structure is improved over our
previous family for more rugged applications
and environments sensitive to electro-static
discharges and associated transients. The
improved ESD tolerance is at least +15kV
without damage nor latch-up.
R
RC
C
C
CS
S
R
RS
S
SW1
SW1
SW2
SW2
RC
Device
Under
Test
DC Power
Source
CS
RS
SW1
SW2
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconductors.
This method is also specified in MIL-STD-883,
Method 3015.7 for ESD testing. The premise of
this ESD test is to simulate the human body’s
potentialtostoreelectro-staticenergyanddischarge
it to an integrated circuit. The simulation is
performed by using a test model as shown in
Figure 7. This method will test the IC’s capability
to withstand an ESD transient during normal
handling such as in manufacturing areas where the
ICs tend to be handled frequently.
TheIEC-1000-4-2,formerlyIEC801-2,isgenerally
used for testing ESD on equipment and systems.
For system manufacturers, they must guarantee a
certain amount of ESD protection since the system
itself is exposed to the outside environment and
human presence. The premise with IEC1000-4-2
is that the system is required to withstand an
amount of static electricity when ESD is applied to
points and surfaces of the equipment that are
accessible to personnel during normal usage. The
transceiver IC receives most of the ESD current
when the ESD source is applied to the connector
pins. The test circuit for IEC1000-4-2 is shown on
Figure 8. There are two methods within IEC1000-
4-2, the Air Discharge method and the Contact
Discharge method.
Figure 7. ESD Test Circuit for Human Body Model


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