MAX17600–MAX17605

4A Sink /Source Current, 12ns, Dual MOSFET Drivers

11

Ordering Information/Selector Guide

Note: All devices are specified over the -40°C to +125°C temperature range. Optional 8-pin 2mm x 3mm TDFN package is

available. Contact your Maxim sales representative for more information.

+Denotes a lead(Pb)-free/RoHS-compliant package.

*EP = Exposed pad.

Package Information

For the latest package outline information and land patterns

“+”, “#”, or “-” in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

Chip Information

PROCESS: BiCMOS

PART

PIN-PACKAGE

CONFIGURATION

LOGIC LEVELS

TOP MARK

MAX17600ATA+

8 TDFN-EP* (3mm x 3mm)

Dual/Inverting

TTL

+BOJ

MAX17600ASA+

8 SO

Dual/Inverting

TTL

+

MAX17600AUA+

8 FMAX-EP*

Dual/Inverting

TTL

+AACI

MAX17601ATA+

8 TDFN-EP* (3mm x 3mm)

Dual/Noninverting

TTL

+BOK

MAX17601ASA+

8 SO

Dual/Noninverting

TTL

+

MAX17601AUA+

8 FMAX-EP*

Dual/Noninverting

TTL

+AACJ

MAX17602ATA+

8 TDFN-EP* (3mm x 3mm)

Inverting/Noninverting

TTL

+BOL

MAX17602ASA+

8 SO

Inverting/Noninverting

TTL

+

MAX17602AUA+

8 FMAX-EP*

Inverting/Noninverting

TTL

+AACK

MAX17603ATA+

8 TDFN-EP* (3mm x 3mm)

Dual/Inverting

HNM

+BOM

MAX17603ASA+

8 SO

Dual/Inverting

HNM

+

MAX17603AUA+

8 FMAX-EP*

Dual/Inverting

HNM

+AACL

MAX17604ATA+

8 TDFN-EP* (3mm x 3mm)

Dual/Noninverting

HNM

+BON

MAX17604ASA+

8 SO

Dual/Noninverting

HNM

+

MAX17604AUA+

8 FMAX-EP*

Dual/Noninverting

HNM

+AACM

MAX17605ATA+

8 TDFN-EP* (3mm x 3mm)

Inverting/Noninverting

HNM

+BOO

MAX17605ASA+

8 SO

Inverting/Noninverting

HNM

+

MAX17605AUA+

8 FMAX-EP*

Inverting/Noninverting

HNM

+AACN

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

8 TDFN-EP

T833+2

21-0137

90-0059

8 SO

S8+2

21-0041

90-0096

8 FMAX

U8E+2

21-0107

90-0145