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SPX1202T-2.5 Datasheet(PDF) 4 Page - Sipex Corporation |
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SPX1202T-2.5 Datasheet(HTML) 4 Page - Sipex Corporation |
4 / 5 page 4 Date: 5/25/04 SPX1202 600mA Low Dropout Positive Linear Regulator © Copyright 2004 Sipex Corporation APPLICATION INFORMATION Output Capacitor To ensure the stability of the SPX1202, an output capacitor of at least 10 µF (tantalum or ceramic)or 50 µF (aluminum) is required. The value may change based on the application requirements of the output load or temperature range. The value of ESR can vary based on the type of capacitor used in the applications. The recommended value for ESR is 0.5 Ω or less. A larger value of output capacitance (up to 100 µF) can improve the load transient response. SOLDERING METHODS The SPX1202 SOT-223 package is designed to be compatible with infrared reflow or vapor- phase reflow soldering techniques. During sol- dering, the non-active or mildly active fluxes may be used. The SPX1202 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Hand soldering and wave soldering should be avoided since these methods can cause damage to the device with excessive thermal gradients on the package. The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared reflow with the component preheated to within 65 °C of the soldering tem- perature range THERMAL CHARACTERISTICS The thermal resistance of SPX1202 depends on the type of package and PC board layout as shown in Table 1. The SPX1202 features the internal thermal limiting to protect the device during overload conditions. Special care needs to be taken during continuous load conditions such that the maximum junction temperature does not exceed 125 °C. Thermal protection is activated at >144 °C and deactiviated at <137°C. Taking the FR-4 printed circuit board and 1/16 thick with 1 ounce copper foil as an experiment, the PCB material is effective at transmitting heat with the tab attached to the pad area and a ground plane layer on the backside of the sub- strate. Refer to table 1 for the results of the experiment. The thermal interaction from other components in the application can effect the thermal resis- tance of the SPX1202. The actual thermal resis- tance can be determined with experimentation. SPX1202 power dissipation is calculated as follows: P D = (VIN - VOUT)(IOUT) Maximum Junction Temperature range: T J = TAMBIENT (max) + PD* (Thermal Resistance) (Junction-to-ambient) Maximum junction temperature must not ex- ceed the 125 °C. Ripple Rejection Ripple rejection can be improved by adding a capacitor between the ADJ pin and ground as shown in Figure 7. When ADJ pin bypassing is used, the value of the output capacitor required increases to its maximum. If the ADJ pin is not bypassed, the value of the output capacitor can be lowered to 10 µF for an electrolytic aluminum capacitor or 2.2 µF for a solid tantalum capacitor (Fig 10). However the value of the ADJ-bypass capacitor should be chosen with respect to the following equation: C = 1 / ( 6.28 * F R * R1 ) Where C = value of the capacitor in Farads (select an equal or larger standard value), F R = ripple frequency in Hz, R 1 = value of resistor R1 in Ohms. If an ADJ-bypass capacitor is used, the ampli- Figure 7. Substrate Layout for SOT-223 50 X 50mm 35 X 17mm 16 X 10mm |
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