4.5± 0.1

1.3± 0.2

0.2± 0.05

5.1± 0.2

Plastic package has underwriters laboratory

f

lammability classification 94V-0

Optimized for LAN protection applications

Low profile package with built-in strain relief for

surface mounted applications

Glass passivated junction

Low incremental surge resistance, excellent clamping

capability

3

00W peak pulse power capability with a 10/1000µs wave-

form, repetition rate (duty cycle): 0.01%

Very fast response time

High temperature soldering guaranteed: 250°C/10

seconds at terminals

Case:JEDEC DO-214AC molded plastic over passivated

chip

Terminals:

solder plated, solderable per MIL-STD-750,

method 2026

Mounting position: any

Weight: 0.002 ounces, 0.064 grams

Operating storage temperature range

-55---+175

(2) Device mounted on an epoxy-glass printed-circuit board, 1.5mm thick; thickness of Cu-layer　≥40μm, see Fig.4.

Typical thermal resistance, junction to ambient

100(NOTE1)

/W

V

Forward voltage

Operating junction temperature range

1.2

-55---+175

Non-repetitive peak reverse power dissipation 10/1000s

3

00

W

BREAKDOWN VOLTAGE: 8.2 --- 220 V

PEAK PULSE POWER: 300 W

DO-214AC(SMA)

MAXIMUM RATINGS AND CHARACTERISTICS

Ratings at 25

ambient temperature unless otherwise specified.

UNIT

VALUE

SYMBOL

Dimensions in millimeters

150(NOTE2)

For more information please refer to the "General Part of associated Handbook".

Devices for Bidirectional Applications

For bi-directional devices, use suffix C (e.g. BZG04-10C). Electrical characteristics apply in both directions.

BZG04 Series

Transient Voltage Suppressor

Features

Mechanical Data

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