DAC5675A-SP

DEVICE INFORMATION

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

13, 20, 26, 39, 44, 49, 50,

Analog negative supply voltage (ground). Pin 13 is internally connected to the heat

AGND

I

52

slug and lid (lid is also grounded internally).

21, 45, 48, 51

I

Analog positive supply voltage

BIASJ

42

O

Full-scale output current bias

CLK

23

I

External clock input

CLKC

22

I

Complementary external clock

LVDS positive input, data bits 13–0.

1, 3, 5, 7, 9, 11, 14, 24, 27,

D[13:0]A

I

D13A is the most significant data bit (MSB).

29, 31, 33, 35, 37

D0A is the least significant data bit (LSB).

LVDS negative input, data bits 13–0.

2, 4, 6, 8, 10, 12, 15, 25,

D[13:0]B

I

D13B is the most significant data bit (MSB).

28, 30, 32, 34, 36, 38

D0B is the least significant data bit (LSB).

DGND

17, 19

I

Digital negative supply voltage (ground)

16, 18

I

Digital positive supply voltage

Internal reference output or external reference input. Requires a 0.1-

μF decoupling

EXTIO

43

I/O

capacitor to AGND when used as reference output.

DAC current output. Full-scale when all input bits are set '0'. Connect the reference

IOUT1

46

O

DAC complementary current output. Full-scale when all input bits are '1'. Connect the

IOUT2

47

O

NC

41

Not connected in chip. Can be high or low.

SLEEP

40

I

Asynchronous hardware power-down input. Active high. Internal pulldown.

Table 2. THERMAL INFORMATION

PARAMETER

TEST CONDITIONS

TYP

UNIT

Junction-to-free-air thermal

Board mounted, per JESD 51-5 methodology

21.813

°C/W

resistance

Junction-to-case thermal resistance

MIL-STD-883 test method 1012

0.849

°C/W

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