DRV3201-Q1

www.ti.com

SLVSBD6 – MAY 2012

ABSOLUTE MAXIMUM RATINGS

(1) (2)

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

MIN

MAX

VS, VSH

DC

VS, negative voltages with minimum serial

–5

38

V

resistor 5

Ω

VS, negative voltages with external protection

–14

38

V

NMOS

VS, VSH

Supply voltage, transient 1s

VS, negative voltages with minimum serial

–5

42

V

resistor 5

Ω

VS, negative voltages with external protection

–14

42

V

NMOS driven by device internal circuit

GHSx

Gate high-side voltage

–7

47

V

SHSx

Source high-side voltage

–7

42

V

GHSx-SHSx

Gate-source high-side voltage

–0.3

15

V

difference

RECOMMENDED OPERATING

CONDITIONS)

GLSx

Gate low-side voltage

–7

20

V

SLSx

Source low-side voltage

–7

7

V

GLSx-SLSx

Gate-source low-side voltage

–0.3

15

V

difference

in RECOMMENDED OPERATING

CONDITIONS)

BOOST, SW

Boost converter

–0.3

60

V

INx, IPx

Current sense Input voltage

–0.3

42

V

INx, IPx clamping

Current sense input current

Clamping current

–5

5

mA

current

Ox

Current sense output voltage

–0.3

ADREF

V

+0.3

Ox forced input current

–10

10

mA

VDDIO, ADREF

Analog input voltage

–0.3

8

V

ILSx,IHSx, EN,

Digital input voltage

–0.3

18

V

DRVOFF, SCLK, NCS,

SDI, RSTN, CSM,

B_EN

SCTH

Analog input voltage

–0.3

18

V

GNDA, GNDL,

Difference one GND or NC to

–0.3

0.3

V

GNDLS_B, PGND, NC

any other GND or NC

Operating virtual junction

–40

150

°C

temperature range

Storage temperature range

–40

165

°C

Lead temperature (soldering, 10

260

°C

s)

ESD performance of all pins to

HBM model

–2

2

kV

any other pin

ESD performance of SHSx to

HBM model

–4

4

kV

SHSx and GND

ESD performance of all pins to

CDM model

–500

500

V

any other pin

Maximum slew rate of SHSx pins

–150

150

V/µs

ERR, SDO, PHxC, RO

Analog/digital output voltages

–0.3

8

V

ERR, SDO, PHxC, RO

Forced input/output current

–10

10

mA

TEST, AMUX, NC

Unused pins. Connect to GND

–0.3

0.3

V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to network ground terminal, unless otherwise specified.

(3)

ESD testing is performed according to AEC-Q100 standard.

Copyright © 2012, Texas Instruments Incorporated

3

Product Folder Link(s): DRV3201-Q1