INA128-HT, INA129-HT

SBOS501D – JANUARY 2010 – REVISED JUNE 2012

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ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

Supply voltage

±18

V

Analog input voltage range

±40

V

Output short-circuit (to ground)

Continuous

HKJ, HKQ, KGD and JD

–55 to 210

packages

Operating temperature

°C

D package

–55 to 175

HKJ, HKQ, KGD and JD

–55 to 210

packages

Storage temperature range

°C

D package

–55 to 175

Lead temperature (soldering, 10s)

300

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

THERMAL CHARACTERISTICS FOR D PACKAGE

INA128

D

UNITS

8 PINS

110

57

54

°C/W

11

53

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

XXX

THERMAL CHARACTERISTICS FOR JD PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

64.9

Junction-to-ambient thermal

°C/W

No airflow

83.4

Junction-to-board thermal resistance High-K board without underfill

27.9

°C/W

Junction-to-case thermal resistance

6.49

°C/W

(1)

The intent of

This methodology is not meant to and will not predict the performance of a package in an application-specific environment.

(2)

JED51-7, high effective thermal conductivity test board for leaded surface mount packages

4

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