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ISO7220AQDRQ1 Datasheet(PDF) 10 Page - Texas Instruments |
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ISO7220AQDRQ1 Datasheet(HTML) 10 Page - Texas Instruments |
10 / 24 page OUT 8 W 13 W IN 750kW 500 W Input Output VCC1 VCC1 VCC1 VCC2 ISO7220A-Q1 ISO7221A-Q1 ISO7221C-Q1 SLLS965C – JULY 2009 – REVISED MAY 2012 www.ti.com DEVICE I/O SCHEMATICS IEC SAFETY LIMITING VALUES Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TEST CONDITIONS MIN MAX UNIT θJA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C 124 Safety input, output, or IS SOIC-8 mA supply current θJA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C 190 TS Maximum case temperature SOIC-8 150 °C The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. 10 Submit Documentation Feedback Copyright © 2009–2012, Texas Instruments Incorporated Product Folder Link(s): ISO7220A-Q1 ISO7221A-Q1 ISO7221C-Q1 |
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