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MSP430F2618TPM Datasheet(PDF) 2 Page - Texas Instruments |
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MSP430F2618TPM Datasheet(HTML) 2 Page - Texas Instruments |
2 / 102 page MSP430F261x MSP430F241x SLAS541J – JUNE 2007 – REVISED DECEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION The Texas Instruments MSP430 family of ultralow-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The calibrated digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs. The MSP430F261x and MSP430F241x series are microcontroller configurations with two built-in 16-bit timers, a fast 12-bit A/D converter, a comparator, dual 12-bit D/A converters, four universal serial communication interface (USCI) modules, DMA, and up to 64 I/O pins. The MSP430F241x devices are identical to the MSP430F261x devices, with the exception that the DAC12 and the DMA modules are not implemented. Typical applications include sensor systems, industrial control applications, hand-held meters, etc. The 12x12- mm LQFP-64 package is also available as a non-magnetic package for medical imaging applications. Table 1. Available Options(1) PACKAGED DEVICES(2) TA PLASTIC 113-PIN BGA (ZQW) PLASTIC 80-PIN LQFP (PN) PLASTIC 64-PIN LQFP (PM) MSP430F2416TPM MSP430F2416TZQW MSP430F2416TPN MSP430F2417TPM MSP430F2417TZQW MSP430F2417TPN MSP430F2418TPM MSP430F2418TZQW MSP430F2418TPN MSP430F2419TPM MSP430F2419TZQW MSP430F2419TPN -40°C to 105°C MSP430F2616TPM MSP430F2616TZQW MSP430F2616TPN MSP430F2617TPM MSP430F2617TZQW MSP430F2617TPN MSP430F2618TPM MSP430F2618TZQW MSP430F2618TPN MSP430F2619TPM MSP430F2619TZQW MSP430F2619TPN MSP430F2618TPMR-NM (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Development Tool Support All MSP430 microcontrollers include an Embedded Emulation Module (EEM) allowing advanced debugging and programming through easy-to-use development tools. Recommended hardware options include: • Debugging and Programming Interface – MSP-FET430UIF (USB) – MSP-FET430PIF (Parallel Port) • Debugging and Programming Interface with Target Board – MSP-FET430U64 (PM Package) – MSP-FET430U80 (PN Package) • Standalone Target Board – MSP-TS430PM64 • Production Programmer – MSP-GANG430 2 Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated |
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