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MSP430FR5737IRHA Datasheet(PDF) 11 Page - Texas Instruments |
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MSP430FR5737IRHA Datasheet(HTML) 11 Page - Texas Instruments |
11 / 109 page A1 A2 A3 A4 A5 B1 B2 B3 B4 B5 C1 C2 D1 D2 D4 D5 E1 E2 E4 E5 YFF PACKAGE (TOP VIEW) C4 C5 D3 E3 C3 NC 1 P1.1 P1.2 P1.3 P1.5 PJ.5 AVCC AVSS P1.4 PJ.1 PJ.4 AVSS DVCC DVSS TEST RST/NMI VCORE P1.6 P2.2 P2.0 PJ.2 PJ.3 P2.1 P1.7 PJ.0 1 NC (no connect). This ball must be attached but remain floating (no electrical connection). P1.0 must be initialized properly to avoid the floating input of the device. MSP430FR573x MSP430FR572x www.ti.com SLAS639D – JULY 2011 – REVISED AUGUST 2012 Pin Designation – MSP430FR5730IYFF, MSP430FR5736IYFF, MSP430FR5738IYFF Package Dimensions: The package dimensions for the YFF package are shown in Table 3. See the package drawing at the end of this data sheet for more details. Table 3. YFF Package Dimensions PACKAGED DEVICES D E MSP430FR5738IYFF MSP430FR5736IYFF 2.04 ± 0.03 2.24 ± 0.03 MSP430FR5730IYFF Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback 11 |
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