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THS4271-EP Datasheet(PDF) 3 Page - Texas Instruments |
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THS4271-EP Datasheet(HTML) 3 Page - Texas Instruments |
3 / 44 page THS4271-EP www.ti.com SGLS270C – DECEMBER 2004 – REVISED APRIL 2010 ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range unless otherwise noted (1) UNIT VS Supply voltage 16.5 V VI Input voltage ±VS IO Output current 100 mA Continuous power dissipation See Dissipation Ratings Table TJ Maximum junction temperature +150°C TJ (2) Maximum junction temperature, continuous operation long term reliability +125°C TJ (3) Maximum junction temperature to prevent oscillation +60°C Tstg Storage temperature range –65°C to +150°C Lead temperature (1,6 mm (1/16 inch) from case for 10 seconds) +300°C HBM 3000 V ESD ratings CDM 1000 V MM 100 V (1) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See Figure 1 for additional information on thermal derating. (3) See Maximum Die Temperature to Prevent Oscillation section in the Application Information of this data sheet. PACKAGE DISSIPATION RATINGS qJC qJA (1) PACKAGE (°C/W) (°C/W) DGN (8 pin)(2) 4.7 58.4 (1) This data was taken using the JEDEC standard High-K test PCB. (2) The THS4271 may incorporate a PowerPAD™ on the underside of the chip. This feature acts as a heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package. Copyright © 2004–2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): THS4271-EP |
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