THS4271-EP

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SGLS270C – DECEMBER 2004 – REVISED APRIL 2010

ABSOLUTE MAXIMUM RATINGS

Over operating free-air temperature range unless otherwise noted

(1)

UNIT

Supply voltage

16.5 V

Input voltage

Output current

100 mA

Continuous power dissipation

See Dissipation Ratings Table

Maximum junction temperature

+150°C

(2)

Maximum junction temperature, continuous operation long term reliability

+125°C

(3)

Maximum junction temperature to prevent oscillation

+60°C

Storage temperature range

–65°C to +150°C

Lead temperature (1,6 mm (1/16 inch) from case for 10 seconds)

+300°C

HBM

3000 V

ESD ratings

CDM

1000 V

MM

100 V

(1)

The absolute maximum temperature under any condition is limited by the constraints of the silicon process. Stresses above these

ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not

implied.

(2)

Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of

overall device life. See Figure 1 for additional information on thermal derating.

(3)

See Maximum Die Temperature to Prevent Oscillation section in the Application Information of this data sheet.

PACKAGE DISSIPATION RATINGS

(1)

PACKAGE

(°C/W)

(°C/W)

4.7

58.4

(1)

This data was taken using the JEDEC standard High-K test PCB.

(2)

The THS4271 may incorporate a PowerPAD™ on the underside of the chip. This feature acts as a

heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure

to do so may result in exceeding the maximum junction temperature which could permanently damage

the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the

PowerPAD thermally enhanced package.

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